Cleaned with 18.2 MΩ·cm UPW ultrasonic deionized water, double-bagged under high-purity nitrogen in Class 1 cleanroom environment.
Tied-diaphragm design with Cobalt-based Elgiloy diaphragm. Eliminates dead leg zones for pyrophoric, corrosive, and toxic semiconductor process gases.
5-axis CNC machined from single aerospace aluminum 6061-T6 block or 316L forging. High vacuum performance compatible with ALD, Etch, and PVD modules.
High-accuracy digital mass flow controller for silane, NF3, chlorine, and carrier gases. Fast response time (< 0.5s) with EtherCAT / DeviceNet fieldbus interface.
| ALLOY ELEMENT / ATTRIBUTE | STANDARD 316L | SEMI F20 BASE | SEMIPURE ULTRA-HIGH PURITY (VIM-VAR) |
|---|---|---|---|
| Chromium (Cr) % | 16.00 - 18.00% | 17.00 - 18.00% | 17.50 - 18.00% (High Corrosion Resistance) |
| Sulfur (S) % (Inclusions) | ≤ 0.030% | ≤ 0.010% | 0.005 - 0.010% (Optimal Weldability) |
| Surface Finish (Ra) | Ra ≤ 0.8 μm (32 μin) | Ra ≤ 0.25 μm (10 μin) | Ra ≤ 0.13 μm (5 μin) Electropolished |
| Cr/Fe Oxide Ratio | Not Specified | ≥ 1.2 : 1 | ≥ 1.5 : 1 (AES Depth Profile Verified) |
| Cleanroom Packaging | Standard Polybag | Class 100 Single Bag | Class 1 (ISO 3) Double Bagged N2 Purged |
Submit your gas stick P&ID schematics, chamber 3D STEP files, or valve bill of materials (BOM). Cleanroom engineers respond with material certification and transparent quotations in 1 business day.